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Dedicated to delivering the best technology and service to you DEUV Laser Machines: Unleashing Precision in Advanced Packaging – Perfecting TGV Formation, Micromachining, and Material Integrity for the Future of Electronics.  |
Highly Controllable Via Size
Number of Via : 140,916 Via Diameter: 72 µm *Inspected by proprietary 3D TGV NIR tool
Controllable Via Shape
Straight-Type Via : Example
Material：Borofloat 33
Glass Thickness：628.7 µm
Via Diameter (Top)：70±3 µm
Via Diameter (Middle)：68±3 µm
Via Diameter (Bottom)：70±3 µm
Aspect Ratio：~9
Position Accuracy：±2 µm
X-Type Via : Example
Material：Borofloat 33
Glass Thickness：628.5 µm
Via Diameter (Top)：70±3 µm
Via Diameter (Middle)：40±3 µm
Via Diameter (Bottom)：70±3 µm
Aspect Ratio：~9
Position Accuracy：±2 µm
Scalable Process with High Yield Rate
High Density Via Formation
